What is ENIG? Learn about ENIG surface finish: layer structure, advantages for fine-pitch and BGA, costs and potential issues.
What is ENIG?
ENIG is a PCB surface finish consisting of a nickel barrier layer topped with a thin gold layer on the copper pads.
ENIG provides a perfectly planar surface ideal for fine-pitch and BGA. The layer structure consists of nickel (3-6 µm) as a diffusion barrier and gold (0.05-0.1 µm) as oxidation protection.
Process and Application
ENIG is also suitable for wire bonding and connector contact surfaces. A known risk is the 'Black Pad' defect, which is minimized through strict process control.
Frequently Asked Questions
Ready for your PCBA project?
SMTEC AG manufactures prototypes and series – fast, flexible and of the highest quality.
Request a quote →