What is OSP? Learn about Organic Solderability Preservative: function, advantages, limitations and comparison with HASL and ENIG.
What is OSP?
OSP is a thin organic protective coating on copper pads that preserves solderability until assembly.
OSP is a thin organic layer applied to bare copper pads to prevent oxidation and maintain solderability. It offers a planar surface, is cost-effective and environmentally friendly.
Process and Application
However, OSP has limited shelf life, is sensitive to handling and offers limited multiple-reflow capability. Best suited for series production with short storage times.
Frequently Asked Questions
Ready for your PCBA project?
SMTEC AG manufactures prototypes and series – fast, flexible and of the highest quality.
Request a quote →