What is a BGA? Learn about Ball Grid Array: construction, soldering process, X-ray inspection and common challenges.
What is BGA?
BGA (Ball Grid Array) is an IC package type where electrical connections are arranged as solder balls in a grid on the underside.
BGA is a widely used IC package with solder balls arranged in a grid on the package underside. Advantages include high pin count in compact size, excellent electrical properties and efficient heat dissipation.
Process and Application
Since solder joints are hidden beneath the package, X-ray inspection is required. Typical BGA defects include head-in-pillow, voids, solder bridges and component misalignment.
Frequently Asked Questions
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