What is QFN? Learn about Quad Flat No-Lead packages: construction, advantages, soldering and inspection.
What is QFN?
QFN (Quad Flat No-Lead) is a compact IC package with solder pads on the underside instead of visible leads.
QFN is a compact IC package with flat pads on the underside edges. Advantages include low profile, small footprint and good thermal/electrical properties. Many QFN packages include an exposed thermal pad for heat dissipation.
Process and Application
Inspection challenges are similar to BGA: partially hidden joints require X-ray in addition to AOI, especially for the exposed pad.
Frequently Asked Questions
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