What is SPI? Learn how Solder Paste Inspection works and why it is essential in the SMT process.
What is SPI?
SPI (Solder Paste Inspection) is a 3D measurement system that checks solder paste deposits after stencil printing for volume, height and position.
SPI automatically measures the volume, height, area and position of solder paste on every pad immediately after stencil printing. Since paste printing is the most common source of SMT defects, SPI is critical for early defect prevention.
Process and Application
Modern SPI systems use 3D measurement technology with micrometer-level resolution, enabling real-time detection of printing issues before components are placed.
Frequently Asked Questions
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