Mixed Technology Assembly

Mixed Technology Assembly

What is Mixed Technology Assembly? Learn how SMT and THT are combined on a single board and which soldering methods are used.

What is Mixed Technology Assembly?

Mixed Technology Assembly combines SMT and THT components on a single circuit board.

Mixed Technology Assembly combines Surface Mount Technology (SMT) and Through-Hole Technology (THT) on a single PCB. This is standard practice since most assemblies contain both SMD and through-hole components.

Process and Application

The typical process flow: SMT side first (paste printing, pick-and-place, reflow soldering), then THT components are inserted and soldered by wave or selective soldering. The challenge lies in process planning – sequence, thermal stress and compatibility must be carefully coordinated.

Frequently Asked Questions

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